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Analysis on annealing-induced stress of blind-via TSV using FEM
Jie SHAO, Tielin SHI, Li DU, Lei SU, Xiangning LU, Guanglan LIAO
《机械工程前沿(英文)》 2018年 第13卷 第3期 页码 401-410 doi: 10.1007/s11465-017-0457-7
Copper-filled through silicon via (TSV) is a promising material owing to its application in high-density three-dimensional (3D) packaging. However, in TSV manufacturing, thermo-mechanical stress is induced during the annealing process, often causing reliability issues. In this paper, the finite element method is employed to investigate the impacts of via shape and SiO2 liner uniformity on the thermo-mechanical properties of copper-filled blind-via TSV after annealing. Top interface stress analysis on the TSV structure shows that the curvature of via openings releases stress concentration that leads to ~60 MPa decrease of normal stresses, sxx and syy, in copper and ~70 MPa decrease sxx of in silicon. Meanwhile, the vertical interface analysis shows that annealing-induced stress at the SiO2/Si interface depends heavily on SiO2 uniformity. By increasing the thickness of SiO2 linear, the stress at the vertical interface can be significantly reduced. Thus, process optimization to reduce the annealing-induced stress becomes feasible. The results of this study help us gain a better understanding of the thermo-mechanical behavior of the annealed TSV in 3D packaging.
关键词: through silicon via (TSV) annealing-induced stress interface stress plastic deformation finite element method
《能源前沿(英文)》 2022年 第16卷 第5期 页码 876-877 doi: 10.1007/s11708-022-0832-x
《能源前沿(英文)》 2021年 第15卷 第3期 页码 772-780 doi: 10.1007/s11708-021-0783-7
关键词: photoelectrocatalysis hydrogen evolution Si photocathode mesoporous MoS2
《环境科学与工程前沿(英文)》 2023年 第18卷 第4期 doi: 10.1007/s11783-024-1805-6
● Urethane functionalities created on PES membranes via electron beam irradiation.
关键词: Surface functionalization Electron beam irradiation Microfiltration Endocrine disrupting chemicals
Effects of nano-silicon and common silicon on lead uptake and translocation in two rice cultivars
Jianguo LIU,Hui CAI,Congcong MEI,Mingxin WANG
《环境科学与工程前沿(英文)》 2015年 第9卷 第5期 页码 905-911 doi: 10.1007/s11783-015-0786-x
关键词: silicon (Si) lead (Pb) rice (Oryza sativa L.) toxicity accumulation
Computer modeling of crystal growth of silicon for solar cells
Lijun LIU, Xin LIU, Zaoyang LI, Koichi KAKIMOTO
《能源前沿(英文)》 2011年 第5卷 第3期 页码 305-312 doi: 10.1007/s11708-011-0155-9
《机械工程前沿(英文)》 2021年 第16卷 第3期 页码 570-579 doi: 10.1007/s11465-021-0642-6
Effect of extrusion temperature on the physical properties of high-silicon aluminum alloy
YANG Fuliang, GAN Weiping, CHEN Zhaoke
《机械工程前沿(英文)》 2007年 第2卷 第1期 页码 120-124 doi: 10.1007/s11465-007-0021-y
关键词: coefficient hermeticity temperature relationship air-atomization
屠海令
《中国工程科学》 2000年 第2卷 第1期 页码 7-17
随着超大规模集成电路设计线宽向深亚微米级(<0.5μm)和亚四分之一微米级(<0.25μm)发展,对半导体硅片及其它硅基材料的质量要求越来越高,研究上述材料中各种杂质的行为,控制缺陷类型及数量,提高晶体完整性,降低表面污染和采用缺陷工程的方法改善材料质量显得尤为重要。文章阐述了深亚微米级和亚四分之一微米级集成电路用大直径硅材料中铁、铜金属和氧、氢、氮非金属杂质元素的行为,点缺陷及其衍生缺陷的本质与控制方法,硅片表面形貌、表面污染与检测方法的研究热点。同时还介绍了外延硅、锗硅及绝缘体上硅(SOI)等硅基材料的特性、制备及工艺技术发展趋势,展望了跨世纪期间硅及硅基材料产业发展的技术经济前景。
Laser enhanced gettering of silicon substrates
Daniel CHEN,Matthew EDWARDS,Stuart WENHAM,Malcolm ABBOTT,Brett HALLAM
《能源前沿(英文)》 2017年 第11卷 第1期 页码 23-31 doi: 10.1007/s11708-016-0441-7
关键词: gettering multicystaline silicon impurities laser doping
Special issue: Technologies for future high-efficiency industrial silicon wafer solar cells
《能源前沿(英文)》 2017年 第11卷 第1期 页码 1-3 doi: 10.1007/s11708-016-0436-4
Effects of taping on grinding quality of silicon wafers in backgrinding
Zhigang DONG, Qian ZHANG, Haijun LIU, Renke KANG, Shang GAO
《机械工程前沿(英文)》 2021年 第16卷 第3期 页码 559-569 doi: 10.1007/s11465-020-0624-0
关键词: taping silicon wafer backgrinding subsurface damage surface roughness
Ultraviolet exposure enhanced silicon direct bonding
Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,
《机械工程前沿(英文)》 2010年 第5卷 第1期 页码 87-92 doi: 10.1007/s11465-009-0078-x
关键词: ultraviolet (UV) exposure silicon direct bonding bonding strength reliability
Jingbin Wen, Kuiyi You, Minjuan Chen, Jian Jian, Fangfang Zhao, Pingle Liu, Qiuhong Ai, He’an Luo
《化学科学与工程前沿(英文)》 2021年 第15卷 第3期 页码 654-665 doi: 10.1007/s11705-020-1973-2
关键词: mesoporous silicon sulfonic acid catalytic hydroamination cyclohexene dicyclohexylamine vapor phase
Silicon carbide waste as a source of mixture materials for cement mortar
Zhengwu Jiang, Qiang Ren, Haoxin Li, Qing Chen
《环境科学与工程前沿(英文)》 2017年 第11卷 第5期 doi: 10.1007/s11783-017-0974-y
关键词: Silicon carbide waste Cement mortar Fluidity Strength Shrinkage
标题 作者 时间 类型 操作
Analysis on annealing-induced stress of blind-via TSV using FEM
Jie SHAO, Tielin SHI, Li DU, Lei SU, Xiangning LU, Guanglan LIAO
期刊论文
Erratum to: Enhancing the photoelectrochemical performance of p-silicon through TiO coating decorated
期刊论文
Enhancing the photoelectrochemical performance of p-silicon through TiO coating decorated with mesoporous
期刊论文
Removal of endocrine disrupting chemicals from water through urethane functionalization of microfiltrationmembranes via electron beam irradiation
期刊论文
Effects of nano-silicon and common silicon on lead uptake and translocation in two rice cultivars
Jianguo LIU,Hui CAI,Congcong MEI,Mingxin WANG
期刊论文
Computer modeling of crystal growth of silicon for solar cells
Lijun LIU, Xin LIU, Zaoyang LI, Koichi KAKIMOTO
期刊论文
Atomistic understanding of interfacial processing mechanism of silicon in water environment: A ReaxFF
期刊论文
Effect of extrusion temperature on the physical properties of high-silicon aluminum alloy
YANG Fuliang, GAN Weiping, CHEN Zhaoke
期刊论文
Laser enhanced gettering of silicon substrates
Daniel CHEN,Matthew EDWARDS,Stuart WENHAM,Malcolm ABBOTT,Brett HALLAM
期刊论文
Effects of taping on grinding quality of silicon wafers in backgrinding
Zhigang DONG, Qian ZHANG, Haijun LIU, Renke KANG, Shang GAO
期刊论文
Ultraviolet exposure enhanced silicon direct bonding
Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,
期刊论文
Mesoporous silicon sulfonic acid as a highly efficient and stable catalyst for the selective hydroamination
Jingbin Wen, Kuiyi You, Minjuan Chen, Jian Jian, Fangfang Zhao, Pingle Liu, Qiuhong Ai, He’an Luo
期刊论文